Small High Vacuum Magnetron Upward Sputtering Coater Coating Machine
I. Equipment Overview
1. Applicable: universities and colleges, research institutes and enterprises for scientific research and small batch preparation of new thin film materials.
2. Product features/uses:
► Small footprint, cheap price, stable performance and low cost of use and maintenance;
► Can be used to prepare single-layer and multi-layer metal film, dielectric film, magnetic film, sensor film and heat-resistant alloy film, hard film, corrosion-resistant film, etc;
► Coating examples: silver, aluminum, copper, nickel, chromium, nickel-chromium alloy, titanium oxide, ITO, silicon dioxide, etc;
► Single-target sputtering, multi-target sequential sputtering, common sputtering and other functions.
II. Technical parameters
Model |
JCP350 |
Vacuum chamber structure |
Vertical top-opening lid structure, rear extraction system, pneumatic lifting open type |
Vacuum chamber size |
Φ350×H350mm |
Heating temperature |
Room temperature~500℃ |
Sputtering method |
Upward sputtering |
Rotating substrate table |
Φ120mm |
Film thickness non-uniformity |
Φ75mm range ≤±5.0% |
Sputtering target/evaporation electrode |
Φ2 inch magnetron target 2pcs, compatible with DC/RF sputtering |
Process gas |
2-3 way gas flow control |
Control method |
PLC + touch screen human-machine interface semi-automatic control system |
Floor space |
(Host) L1600×W800×H1920mm |
Total power |
≥8KW |