Small High Vacuum Magnetron Sputtering and Evaporation Coater with PLC Touch Screen Control
I. Equipment overview
1. Applicable: universities and colleges, research institutes and enterprises for scientific research and small batch preparation of new thin film materials.
2. Product features/uses:
► Equipment can be used for both sputtering/evaporation; small footprint, inexpensive, stable performance, low cost of use and maintenance;
► It can be used to prepare single-layer and multi-layer metal films, dielectric films, magnetic films, sensor films and heat-resistant alloy films, hard films, corrosion-resistant films, etc;
► Coating examples: silver, aluminum, copper, nickel, chromium, nickel-chromium alloy, titanium oxide, ITO, silicon dioxide, etc;
► Single-target sputtering, multi-target sequential sputtering, common sputtering and other functions.
II. Technical parameters
Model |
JCP200 |
Vacuum chamber structure |
Vertical top-opening lid structure, lower extraction system, manual gas spring lifting open type |
Vacuum chamber size |
Φ220×H300mm |
Heating temperature |
Room temperature~500℃ |
Sputtering method |
Upward sputtering |
Rotating substrate table |
Φ100mm |
Film thickness non-uniformity |
Within Φ50mm≤±5.0% |
Sputtering target/evaporation electrode |
1 Φ2 inch magnetron target, compatible with DC/RF sputtering |
Process gas |
1-2 way gas flow control |
Control method |
PLC touch screen control |
Floor space |
(Host) L600×W800×H1700mm |
Total power |
≥6KW |