The thermal shock test box is mainly used to test the resistance of materials to extremely high or very low temperatures. This situation is similar to the situation of discontinuous high or low temperature. The thermal shock test can make various items in the shortest time complete test. The changes or physical damage caused by thermal shocks are caused by changes in thermal expansion and contraction or changes in other physical values. Only when the PID system is adopted can all kinds of products gain complete trust. The effects of thermal shock include electrochemical changes caused by product cracking or cracking and displacement. The full digital element automatic control of the PID system will make it easy for you to operate.

Application

The thermal shock test box is widely used in electronic and electrical components, automation components, communication components, auto parts, metals, chemical materials, plastics and other industries, defense industry, aerospace, ordnance industry, BGA, PCB base board, electronic chip IC, The physical changes of semiconductor ceramics and polymer materials, the repeated resistance of the material to high and low temperatures, and the chemical changes or physical damage of the product due to thermal expansion and contraction, can confirm the quality of the product, from precision IC to heavy Mechanical components can be used as a basis or reference for product improvement.